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PROSOUND Printed Circuit Assembly offers the latest technology and processes, combined with quality management systems. 

The Company specializes in medium to high volume, high mix/high complexity mixed technology (SMT and Through Hole) placement. 

PROSOUND offers assembly and both in-circuit and functional testing. All facilities feature state-of-the-art equipment complemented by tight process monitoring. 

In addition to state-of-the-art assembly technologies, PROSOUND utilizes the most efficient processes available. The "continuous flow" process, used in all production, significantly reduces in-process times and improves delivery, while minimizing handling-related quality issues and assembly costs. 

  

Technology Capability Highlights 
WAVE SOLDER MACHINE 8035C SEHO
WAVE SOLDER MACHINE  8035PCS SEHO
FUJI SCREEN PRINTER GSP II - 4000 FUJI 
FUJI GLUE DISPENSER FGL II - 4000 FUJI 
FUJI CHIP SHOOTER CP IV - 4000 FUJI
FUJI CHIP SHOOTER CP IV - 2 - 4000 FUJI
FUJI IC PLACER IP III FUJI
REFLOW OVEN SMT 460 / 1.6C SMT
REFLOW OVEN SMT 460 / 1.7C SMT
AXIAL COMPONENT SEQUENCER UCSM - G - 60 DYNAPERT 
AXIAL COMPONENT INSERTER VCD X V12000 DYNAPERT 
UNIVERSAL RADIAL INSERTER R6358 UNIVERSAL 
Materials
Glass Epoxy, CEM1, Paper Phenolic